Formula 1 used to be shaped almost entirely on real asphalt, with drivers pounding around private test tracks until the ...

Abstract: Gold wire ball thermosonic bonding process is a key process of internal interconnection of hybrid integrated circuits, which plays a decisive role in the performance and reliability of ...

Abstract: In this work a numerical simulation model for chip to wafer hybrid bonding process with polymer dielectrics is developed using finite element analysis. Virtual design of experiments is ...

There’s always a strange joy in watching virtual money go up. Business simulation games have a special kind of magic. What ...